Microstructure and Strength of the TiB2 Cermet/TiAl Joint Diffusion Bonded with Ni Interlayer
摘要
Vacuum diffusion bonding of TiB2 cermet to TiAl -based alloys using Ni interlayer has been carried out at 1123～1323 K for0.6～3.6 ks under 80 MPa. The effects of joining parameters on the microstructure of the joints and mechanical propertieswas investigated. The results showed that a TiAlNi2 intermetallic layer and two Ti, Al, Ni solid solution layers were formed atthe interface of Ni/TiAl. The shear strength was 110 MPa with bonding temperature at 1223 K, bonding time for 1.8 ks andbonding pressure under 80 MPa.
引用本文（GB/T 7714）
Zhuoran, Li, Jicai, 等. Microstructure and Strength of the TiB2 Cermet/TiAl Joint Diffusion Bonded with Ni Interlayer[J]. Acta Scientiarum Naturalium Universitatis Sunyatseni, 2003.
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