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Tangent Resistance of Soil on Moldboard and the Mechanism of Resistance Reduction of Bionic Moldboard

Deng DengShi-qiaoRenLu-quanLiuYanHan HanZhiwu

2005Acta Scientiarum Naturalium Universitatis SunyatseniEngineering被引 1

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摘要

The tangent resistance on the interface of the soil-moldboard is an important component of the resistance to moving soil . We developed simplified mechanical models to analyze this resistance. We found that it is composed of two components, the frictional and adhesive resistances. These two components originate from the soil pore, which induced a capillary suction effect, and the soil-moldboard contact area produced tangent adhesive resistance. These two components varied differently with soil moisture. Thus we predicted that resistance reduction against soil exerted on the non-smooth bionic moldboard is mainly due to the elimination of capillary suction and the reduction of physical-chemical adsorption of soil.

引用本文(GB/T 7714)

Deng Deng, Shi-qiao, Ren, 等. Tangent Resistance of Soil on Moldboard and the Mechanism of Resistance Reduction of Bionic Moldboard[J]. Acta Scientiarum Naturalium Universitatis Sunyatseni, 2005.

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