THERMAL STRESS MEASUREMENT OF QUARTZ OSCILLATOR MODULE PACKAGING
摘要
The thermal stress of the quartz oscillator module packaging is investigated using distal-im-age correlation method(DICM),and the experimental results are given.Under the quartz oscillator modulepackaging,the quartz oscillator and the Fe-Sn-Cu alloy frame are joined together with the electroconductiveadhesive(PI),and the electroconductive adhesive needs to be cured twice at 150℃ and 275℃ respective-ly.As the quartz oscillator and the Fe-Sn-Cu alloy frame have a distinct difference in both thermal expansioncoefficients and mechanical properties and in process of packaging temperature rises or drops,the thermalstress is yielded easily.While temperalure drops,the normal stress at the quartz oscillator edge is a tensilestress,which can make the quartz oscillator fracture.