Bond strength of W-Cu/CuCr integrated material
摘要
The bond strength of W Cu/CuCr integrated material was investigated. The results show that the fracture of W Cu/CuCr integrated material often takes place at W Cu/CuCr interface. Some alloying elements enhance the bond of W and CuCr alloy, which results in the increase of the strength of the W Cu/CuCr interface. And the fracture of the W Cu/CuCr integrated material occurs in the CuCr alloy part, not at the W Cu/CuCr interface. Chromium in CuCr alloy part of the integrated material can improve Cr diffusing from the CuCr alloy to W Cu composite and can be alloyed (near the W Cu/CuCr interface) in the W Cu composite. Thus the strength of W Cu/CuCr interface is also increased.
引用本文（GB/T 7714）
Fan Zhi. Bond strength of W-Cu/CuCr integrated material[J]. 未知来源, 2001.
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