Solder bridge mechanism in surface mount technology
摘要
In the light of the minimum energy principle, the energy equation for the forming process of a joint is formulated, and the forming process of bridged joints is numerically simulated. On this basis, the mechanism of bridging in surface mount technology (SMT) is investigated.
引用本文（GB/T 7714）
Lei Zhang. Solder bridge mechanism in surface mount technology[J]. 未知来源, 2001.
引文网络
本站仅收录题录与摘要供学习参考，全文版权归属出版方；如有侵权请联系我们删除。