Surface tension and screen printing precision

1996中国科学通报：英文版Engineering被引 1

摘要

With continued demands for better performance of VLSI,the electronic industry haspaid much attention to packaging technology.Thick-film technology is important in pack-age.The increases of circuit densities in high-density microelectronic packaging requestreduction of the width of printing lines.

引用本文（GB/T 7714）

梁彤翔, 孙文珍, 田民波, 等. Surface tension and screen printing precision[J]. 中国科学通报：英文版, 1996.

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