Studies on Adsorption Behavior and Mechanism of Copper（ II ） onto Amino Methylene Phosphonic Acid Resin
摘要
The adsorption behavior and the mechanism of a novel chelate resin, amino methylene phosphonic acid resin(APAR) for Cu(Ⅱ) were investigated. Cu(Ⅱ) was quantitatively adsorbed by APAR in the medium of pH=4.09. The statically saturated adsorption capacity is 181 mg/(g resin). Cu(Ⅱ) adsorbed on APAR can be eluted by 1.0-3.0 mol/L HCl. The rate constant is k298=5.58×10-5 s-1. The adsorption of Cu(Ⅱ) on APAR follows the Freundlich isotherm. The ΔH of the adsorption is 3.91 kJ/mol. The apparent activation energy is Ea=21.4 kJ/mol. The coordination molar ratio of APAR to Cu(Ⅱ) is 1/1. It is shown that the nitrogen and the oxygen atoms in the functional group of APAR coordinate to Cu(Ⅱ).
引用本文（GB/T 7714）
XiongChunhua, WANGYong-jiang, SHILin-mei. Studies on Adsorption Behavior and Mechanism of Copper（ II ） onto Amino Methylene Phosphonic Acid Resin[J]. Acta Scientiarum Naturalium Universitatis Sunyatseni, 2003.
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