Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold
摘要
Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of black pad and the possible measure of eliminating or alleviating the black pad were also introduced. The development direction and market prospects of ENIG were prospected.
引用本文（GB/T 7714）
刘海萍, Ning Li, 毕四富, 等. Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold[J]. Acta Scientiarum Naturalium Universitatis Sunyatseni, 2007.
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