Role of temperature gradient in liquid／solid phase solution-diffusion bonding
摘要
The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the bonding time decreases and the interface migration velocity increases bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time.
引用本文（GB/T 7714）
翟秋亚, 徐锦锋. Role of temperature gradient in liquid／solid phase solution-diffusion bonding[J]. 中国焊接：英文版, 2004.
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